An adhesion study in Ni and Cu nanocontacts from a molecular dynamics perspective
Date
2023
Journal Title
Journal ISSN
Volume Title
Publisher
Elsevier
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Abstract
In this work, the effects of adhesion in nanoscale indentation tests with copper and nickel samples indented with
a spherical diamond tip have been studied. The tests have been simulated by molecular dynamics, initially
selecting the appropriate potentials according to the pair of materials put in contact. The force-displacement
curves of a complete cycle of loading and unloading have been determined and a procedure for the simultaneously determination of the indentation modulus of elasticity and the adhesion energy of inelastic indentations
have been developed. Likewise, a critical evaluation of the contact models available in the literature has been
carried out, assessing their suitability for the cases analysed.
Description
Keywords
Citation
S. González-Tortuero, M.A. Garrido, J. Rodríguez, An adhesion study in Ni and Cu nanocontacts from a molecular dynamics perspective, European Journal of Mechanics - A/Solids, Volume 99, 2023, 104942, ISSN 0997-7538, https://doi.org/10.1016/j.euromechsol.2023.104942
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