Shear bond strength of a flash-free orthodontic adhesive system after thermal aging procedure

Abstract

Background: The aim of this study was to compare the shear bond strength (SBS) of a flash-free and precoated orthodontic adhesive with a compomer orthodontic adhesive before and after thermocycling. The adhesive remnant index (ARI) was also determined for both adhesives.

Material and methods: The adhesive remnant index (ARI) was also determined for both adhesives. Material and Methods: A total of 120 human premolars were randomly divided into two groups (n=60) according to the orthodontic adhesive used: APC Flash-Free Adhesive Coated Appliance System (APC FF) or Transbond PLUS Color Change Adhesive (TP), as control. A SBS test was performed and ARI value for each specimen was also assessed. Results were analyzed by two-way ANOVA and Tukey's Chi-square test (p<0.05).

Results: SBS values were significantly influenced by thermocycling (p<0.01). Neither the orthodontic adhesive nor the interaction between adhesive and thermocycling statistically affected SBS results (p>0.05).

Conclusions: APC FF and TP showed similar bond strength results. Thermocycling induced a significant decrease in SBS values for the two adhesives tested, without differences between 10,000 and 20,000 thermal cycles. Moreover, APC FF left less adhesive remnants on the enamel compared to TP. Key words:APC Flash-Free, APC cement, aging, orthodontics, resin cements.